Digital Twin Consortium hosting central piece of proposed technical solution to the DPP open-source.
By Erich Barnstedt, Senior Director & Architect Industrial Standards, Corporate Standards Group, Microsoft Corporation
At SPS – Smart Production Solutions (SPS) in November 2024, we announced the “joint forces” initiative, together with 7 partner consortia, focusing on how Digital Product Passports (including Digital Battery Passports) can be built by combining existing, international, IEC standards.
Back then it was just an idea, but it gained significant, additional momentum since then and we now have 11 consortia supporting the initiative, along with the world’s largest OT and IT companies. So, the pressure was significant to turn this idea into realty quickly and make it available 4 months later at HMI 2025 as open-source reference apps and services.
Today, we are happy to announce that we achieved it.
Specifically, the OPC Foundation now has an open-source tool to automatically convert all Asset Administration Shell (AAS) Submodel Templates published by the IDTA – Industrial Digital Twin Association (IDTA) into OPC UA nodeset files and uploaded them to the publicly and freely available UA Cloud Library. From there, they can be loaded into your favorite OPC UA modelling app, of which there are plenty available for free, and a Digital Product Passport containing for example a Product Carbon Footprint (PCF) or a digital nameplate is just a few clicks away.
The finished DPP can then be uploaded into the Digital Twin Consortium’s AAS Repository, available as a reference implementation open-source on GitHub and as a pre-built Docker-enabled app.
This AAS Repository is now fully OPC UA-enabled, including support for the OPC UA OpenAPI REST interface.
This workflow is now supported by leading cloud vendors for industrial dataspace applications and also forms part of the OPC Foundation’s Cloud Initiative reference architecture, which will be unveiled at the OPC Foundation’s HMI conference on Wednesday April 2nd, 2025 next week.
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